Other questions that we have thought about are:
Is this a machine that is designed for testing a single flexure (to characterize it), or is this an inspection machine that would be used to test and characterize lots of flexures on a wafer rapidly. For now we will develop a work bench device that can measure a single flexure on a wafer. A general automatic inspection machine is a potential further development of this project.
For our 2.75 project we
Do we need to characterize the time of the "snap through" of the flexures or can we slowly move the flexure through it's range of motion (ignoring the time aspect).
Are there other shapes and configurations that we need to test?
How sensitive are these to devices to temperature?
Are these relays actuated internal or by some external means?
If external how sensitive are these to being actuate not at the center of beam?
Does our design need to be such that it has the same foot print as the flexure so you and test a whole wafer at once?
What are our set up time requirements?
How many cycles do we need to run through? Can we/ do we want to use this for fatigue testing these flexure too?